Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

For validating BGA and LGA devices with a 0.65-mm pitch, the company's latest hybrid socket adapter design deploys both male and female pins in an interstitial pattern. Its design provides the ...

Tsunami grid array sockets comprise 0.65-mm, 0.80-mm, 1.0-mm, and 1.27-mm pitch open-top sockets, as well as 1.00-mm and 1.27-mm clamshell sockets. The clamshell devices include a Z-axis adjustment ...

Complying with the Restriction of Hazardous Substances directive and other worldwide initiatives for lead-free manufacturing, the company now offers lead-free solder ball terminal options on select ...